View SA58632_1110438.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

SA58632
2 x 2.2 W BTL audio amplifier
Rev. 01 -- 27 June 2006 Product data sheet
1. General description
The SA58632 is a two-channel audio amplifier in an HVQFN20 package. It provides power output of 2.2 W per channel with an 8 load at 9 V supply. The internal circuit is comprised of two BTL (Bridge-Tied Load) amplifiers with a complementary PNP-NPN output stage and standby/mute logic. The SA58632 is housed in a 20-pin HVQFN package, which has an exposed die attach paddle enabling reduced thermal resistance and increased power dissipation.
2. Features
I I I I I I I I I Low junction-to-ambient thermal resistance using exposed die attach paddle Gain can be fixed with external resistors from 6 dB to 30 dB Standby mode controlled by CMOS-compatible levels Low standby current < 10 A No switch-on/switch-off plops High power supply ripple rejection: 50 dB minimum ElectroStatic Discharge (ESD) protection Output short circuit to ground protection Thermal shutdown protection
3. Applications
I Professional and amateur mobile radio I Portable consumer products: toys and games I Personal computer remote speakers
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
4. Quick reference data
Table 1. Quick reference data VCC = 6 V; Tamb = 25 C; RL = 8 ; VMODE = 0 V; measured in test circuit Figure 3; unless otherwise specified. Symbol VCC Iq Istb Po Parameter supply voltage quiescent current standby current output power Conditions operating RL = VMODE = VCC THD+N = 10 % THD+N = 0.5 % THD+N = 10 %; VCC = 9 V THD+N PSRR total harmonic distortion-plus-noise power supply rejection ratio Po = 0.5 W
[2] [3] [1]
Min 2.2 1.2 0.9 50 40
Typ 9 15 1.5 1.1 2.2 0.15 -
Max 18 22 10 0.3 -
Unit V mA A W W W % dB dB
[1] [2]
With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the DC output offset voltage divided by RL. Supply voltage ripple rejection is measured at the output with a source impedance of Rs = 0 at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail. Supply voltage ripple rejection is measured at the output, with a source impedance of Rs = 0 at the input. The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail.
[3]
5. Ordering information
Table 2. Ordering information Name SA58632BS HVQFN20 Description plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 6 x 5 x 0.85 mm Version SOT910-1 Type number Package
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
2 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
6. Block diagram
VCCL VCCR
SA58632
INL- INL+ 15 14
R
17
10 16
OUTL-
VCCL
R
20 k
1
OUTL+
20 k
STANDBY/MUTE LOGIC
INR- INR+
12 13
R
11
OUTR-
VCCR
R
20 k
6
OUTR+
SVR
3
20 k
MODE BTL/SE
2 4
STANDBY/MUTE LOGIC
5 n.c.
8
9
19
18
20
7
GND GND GND GND LGND RGND
002aac078
Fig 1. Block diagram of SA58632
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
3 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
7. Pinning information
7.1 Pinning
20 LGND 17 VCCL 16 OUTL- 15 INL- 14 INL+ 13 INR+ 12 INR- 11 OUTR- VCCR 10 7 8 GND 9 GND
002aac079
19 GND
terminal 1 index area OUTL+ MODE SVR BTL/SE n.c. OUTR+ 1 2 3 4 5 6
SA58632BS
Transparent top view
Fig 2. Pin configuration for HVQFN20
7.2 Pin description
Table 3. Symbol OUTL+ MODE SVR BTL/SE n.c. OUTR+ RGND GND VCCR OUTR- INR- INR+ INL+ INL- OUTL- VCCL LGND
[1]
Pin description Pin 1 2 3 4 5 6 7 8, 9, 18, 19 10 11 12 13 14 15 16 17 20 Description positive loudspeaker terminal, left channel operating mode select (standby, mute, operating) half supply voltage, decoupling ripple rejection BTL loudspeaker or SE headphone operation not connected positive loudspeaker terminal, right channel ground, right channel ground[1] supply voltage; right channel negative loudspeaker terminal, right channel negative input, right channel positive input, right channel positive input, left channel negative input, left channel negative output terminal, left channel supply voltage, left channel ground, left channel
Pins 8, 9, 18 and 19 are connected to the lead frame and also to the substrate. They may be kept floating. When connected to the ground plane, the PCB can be used as heatsink.
SA58632_1
RGND
18 GND
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
4 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
8. Functional description
The SA58632 is a two-channel BTL audio amplifier capable of delivering 2 x 1.5 W output power to an 8 load at THD+N = 10 % using a 6 V power supply. It is also capable of delivering 2 x 2.2 W output power to an 8 load at THD+N = 10 % using a 9 V power supply. Using the MODE pin, the device can be switched to standby and mute condition. The device is protected by an internal thermal shutdown protection mechanism. The gain can be set within a range of 6 dB to 30 dB by external feedback resistors.
8.1 Power amplifier
The power amplifier is a Bridge-Tied Load (BTL) amplifier with a complementary PNP-NPN output stage. The voltage loss on the positive supply line is the saturation voltage of a PNP power transistor, on the negative side the saturation voltage of an NPN power transistor. The total voltage loss is < 1 V. With a supply voltage of 6 V and an 8 loudspeaker, an output power of 1.5 W can be delivered to the load, and with a 9 V supply voltage and an 8 loudspeaker an output power of 2.2 W can be delivered.
8.2 Mode select pin (MODE)
The device is in Standby mode (with a very low current consumption) if the voltage at the MODE pin is greater than VCC - 0.5 V, or if this pin is floating. At a MODE voltage in the range between 1.5 V and VCC - 1.5 V the amplifier is in a mute condition. The mute condition is useful to suppress plop noise at the output, caused by charging of the input capacitor. The device is in Active mode if the MODE pin is grounded or less than 0.5 V (see Figure 6).
8.3 BTL/SE output configuration
To invoke the BTL configuration (see Figure 3), the BTL/SE pin is taken to logic HIGH or not connected. The output differentially drives the speakers, so there is no need for coupling capacitors. The headphone can be connected to the amplifier negative outputs using a coupling capacitor for each channel. The headphone common ground is connected to the amplifier ground. To invoke the Single-Ended (SE) configuration (see Figure 15), the BTL/SE pin is taken to logic LOW or connected to ground. The positive outputs are muted with a DC level of 0.5VCC. Using a coupling capacitor for each channel, speakers can be connected to the amplifier negative outputs. The speaker common ground is connected to the amplifier ground. Headphones can be connected to the negative outputs without using output coupling capacitors. The headphone common ground pin is connected to one of the amplifier positive output pins.
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
5 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
9. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC VI IORM Tstg Tamb VP(sc) Ptot Parameter supply voltage input voltage repetitive peak output current storage temperature ambient temperature short-circuit supply voltage total power dissipation HVQFN20 non-operating operating Conditions operating Min -0.3 -0.3 -55 -40 Max +18 VCC + 0.3 1 +150 +85 10 2.2 Unit V V A C C V W
10. Thermal characteristics
Table 5. Symbol Rth(j-a) Rth(j-sp) Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to solder point Conditions in free air 64.5 mm2 (10 square inch) heat spreader
[1]
Typ 80 22 3
Unit K/W K/W K/W
[1]
Thermal resistance is 22 K/W with DAP soldered to 64.5 mm2 (10 square inch), 1 ounce copper heat spreader.
11. Static characteristics
Table 6. Static characteristics VCC = 6 V; Tamb = 25 C; RL = 8 ; VMODE = 0 V; measured in test circuit Figure 3; unless otherwise specified. Symbol VCC Iq Istb VO VO(offset) IIB VMODE Parameter supply voltage quiescent current standby current output voltage differential output voltage offset input bias current voltage on pin MODE pins INL+, INR+ pins INL-, INR- operating mute standby IMODE VI(SE) VI(BTL) II(SE) current on pin MODE input voltage on pin BTL/SE input voltage on pin BTL/SE input current on pin BTL/SE 0 V < VMODE < VCC single-ended (SE) BTL VI(SE) = 0 V; pin connected to ground in SE mode Conditions operating RL = VMODE = VCC
[2] [1]
Min 2.2 0 1.5 VCC - 0.5 0 2 -
Typ 9 15 2.2 -
Max 18 22 10 50 500 500 0.5 VCC - 1.5 VCC 20 0.6 VCC 100
Unit V mA A V mV nA nA V V V A V V A
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
6 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
[1] [2]
With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the DC output offset voltage divided by RL. The DC output voltage with respect to ground is approximately 0.5 x VCC.
12. Dynamic characteristics
Table 7. Dynamic characteristics VCC = 6 V; Tamb = 25 C; RL = 8 ; f = 1 kHz; VMODE = 0 V; measured in test circuit Figure 3; unless otherwise specified. Symbol Po Parameter output power Conditions THD+N = 10 % THD+N = 0.5 % THD+N = 10 %; VCC = 9 V; application demo board THD+N Gv(cl) Zi Vn(o) PSRR VO(mute) cs
[1] [2] [3] [4] [5]
Min 1.2 0.9 [1]
Typ 1.5 1.1 2.2 0.15 100 -
Max 0.3 30 100 200 -
Unit W W W % dB k V dB dB V dB
total harmonic distortion-plus-noise closed-loop voltage gain differential input impedance noise output voltage power supply rejection ratio mute output voltage channel separation
Po = 0.5 W
6 50 40 40
[2] [3] [4]
mute condition
[5]
Gain of the amplifier is 2 x (R2 / R1) in test circuit of Figure 3. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance of Rs = 0 at the input. Supply voltage ripple rejection is measured at the output with a source impedance of Rs = 0 at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail. Supply voltage ripple rejection is measured at the output, with a source impedance of Rs = 0 at the input. The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail. Output voltage in mute position is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, which includes noise.
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
7 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
13. Application information
13.1 BTL application
Tamb = 25 C, VCC = 9 V, f = 1 kHz, RL = 8 , Gv = 20 dB, audio band-pass 22 Hz to 22 kHz. The BTL diagram is shown in Figure 3.
1 F
R2 50 k R1 10 k
VCC INL- INL+ 15 14 17 10 16 OUTL-
RL 100 nF 100 F
VIL C3 47 F
OUTR-
1 F R4 50 k R3 10 k VIR
1
OUTL+
SA58632
INR- INR+ SVR MODE BTL/SE 12 13 3 2 4 20 7 GND
002aac080
11
OUTR-
RL
6
OUTR+
R2 Gain left = 2 x -----R1 R4 Gain right = 2 x -----R3
Pins 8, 9, 18 and 19 connected to ground.
Fig 3. Application diagram of SA58632 BTL differential output configuration
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
8 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
14. Test information
14.1 Static characterization
The quiescent current has been measured without any load impedance (Figure 4). Figure 6 shows three areas: operating, mute and standby. It shows that the DC switching levels of the mute and standby respectively depends on the supply voltage level.
30 Iq (mA) 20
002aac081
10 VO (V) 1 10-1 10-2 10-3
(1) (2) (3)
002aac089
10
10-4 10-5
0 0 4 8 12 16 20 VCC (V)
10-6 10-1
1
10 VMODE (V)
102
RL =
Band-pass = 22 Hz to 22 kHz. (1) VCC = 3 V. (2) VCC = 5 V. (3) VCC = 12 V.
Fig 4. Iq versus VCC
16 VMODE (V) 12
Fig 5. VO versus VMODE
002aac090
standby
8 mute 4
0 0 4 8
operating 12 VCC (V) 16
Fig 6. VMODE versus VCC
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
9 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
14.2 BTL dynamic characterization
The total harmonic distortion-plus-noise (THD+N) as a function of frequency (Figure 7) was measured with a low-pass filter of 80 kHz. The value of capacitor C2 influences the behavior of PSRR at low frequencies; increasing the value of C2 increases the performance of PSRR.
10 THD+N (%) 1
(1)
002aac083
-60 cs (dB) -70
(1) (2)
002aac084
-80
(3)
10-1
(2)
-90
10-2 10
102
103
104 f (Hz)
105
-100 10
102
103
104 f (Hz)
105
Po = 0.5 W; Gv = 20 dB. (1) VCC = 6 V; RL = 8 . (2) VCC = 7.5 V; RL = 16 .
VCC = 6 V; VO = 2 V; RL = 8 . (1) Gv = 30 dB. (2) Gv = 20 dB. (3) Gv = 6 dB.
Fig 7. THD+N versus frequency
-20 PSRR (dB) -40
Fig 8. Channel separation versus frequency
002aac085
(1) (2)
-60
(3)
-80 10
102
103
104 f (Hz)
105
VCC = 6 V; Rs = 0 ; Vripple = 100 mV. (1) Gv = 30 dB. (2) Gv = 20 dB. (3) Gv = 6 dB.
Fig 9. PSRR versus frequency
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
10 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
14.3 Thermal behavior
The measured thermal performance of the HVQFN20 package is highly dependent on the configuration and size of the heat spreader on the application demo board. Data may not be comparable between different semiconductors manufacturers because the application demo boards and test methods are not standardized. Also, the thermal performance of packages for a specific application may be different than presented here, because of the configuration of the copper heat spreader of the application boards may be significantly different. Philips Semiconductors uses FR-4 type application boards with 1 ounce copper traces with solder coating. The demo board (see Figure 23) has a 1 ounce copper heat spreader that runs under the IC and provides a mounting pad to solder to the die attach paddle of the HVQFN20 package. The heat spreader is symmetrical and provides a heat spreader on both top and bottom of the PCB. The heat spreader on top and bottom side of the demo board is connected through 2 mm diameter plated through holes. Directly under the DAP (Die Attach Paddle), the top and bottom side of the PCB are connected by four vias. The total top and bottom heat spreader area is 64.5 mm2 (10 in2). The junction to ambient thermal resistance, Rth(j-a) = 22 K/W for the HVQFN20 package when the exposed die attach paddle is soldered to 5 square inch area of 1 ounce copper heat spreader on the demo PCB. The maximum sine wave power dissipation for Tamb = 25 C is: 150 - 25 -------------------- = 5.7 W 22 Thus, for Tamb = 60 C the maximum total power dissipation is: 150 - 60 -------------------- = 4.1 W 22 The power dissipation versus ambient temperature curve (Figure 10) shows the power derating profiles with ambient temperature for three sizes of heat spreaders. For a more modest heat spreader using 5 square inch area on the top or bottom side of the PCB, the Rth(j-a) is 31 K/W. When the package is not soldered to a heat spreader, the Rth(j-a) increases to 60 K/W.
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
11 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
6 P (W) 4
(1)
002aac283
(2)
2
(3)
0 0 40 80 120 160 Tamb (C)
(1) 64.5 mm2 heat spreader top and bottom (1 ounce copper). (2) 32.3 mm2 heat spreader top or bottom (1 ounce copper). (3) No heat spreader.
Fig 10. Power dissipation versus ambient temperature
The characteristics curves (Figure 11a and Figure 11b, Figure 12, Figure 13a and Figure 13b, and Figure 14) show the room temperature performance for SA58632 using the demo PCB shown in Figure 23. For example, Figure 11 "Power dissipation versus output power" (a and b) show the performance as a function of load resistance and supply voltage. Worst case power dissipation is shown in Figure 12. Figure 13a shows that the part delivers typically 2.8 W per channel for THD+N = 10 % using 8 load at 9 V supply, while Figure 13b shows that the part delivers 3.3 W per channel at 12 V supply and 16 load, THD+N = 10 %.
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
12 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
3 P (W) 2
(3) (2)
002aac288
3
(4)
002aac289
P (W) 2
(3) (2)
1
(1)
1
(1)
0 0 1 2 Po (W) 3
0 0 1 2 3 Po (W) 4
(1) VCC = 6 V. (2) VCC = 7.5 V. (3) VCC = 9 V.
(1) VCC = 6 V. (2) VCC = 7.5 V. (3) VCC = 9 V. (4) VCC = 12 V.
a. RL = 8 ; f = 1 kHz; Gv = 20 dB Fig 11. Power dissipation versus output power
b. RL = 16 ; f = 1 kHz; Gv = 20 dB
4 Po (W) 3
002aac287
2
(1)
(2)
(3)
1
0 0 4 8 VCC (V) 12
(1) RL = 4 . (2) RL = 8 . (3) RL = 16 .
Fig 12. Worst case power dissipation versus VCC
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
13 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
102 THD+N (%) 10
(1) (2) (3)
002aac284
102 THD+N (%) 10
002aac285
(1) (2) (3) (4)
1
1
10-2
10-2
10-3 10-2
1 Po (W)
10
10-3 10-3
10-2
1 Po (W)
10
(1) VCC = 6 V. (2) VCC = 7.5 V. (3) VCC = 9 V.
(1) VCC = 6 V. (2) VCC = 7.5 V. (3) VCC = 9 V. (4) VCC = 12 V.
a. RL = 8 ; f = 1 kHz; Gv = 20 dB Fig 13. THD+N versus output power
b. RL = 16 ; f = 1 kHz; Gv = 20 dB
4 Po (W) 3
(2)
002aac286
(3)
2
1
(1)
0 0 4 8 VCC (V) 12
THD+N = 10 %; f = 1 kHz; Gv = 20 dB. (1) RL = 4 . (2) RL = 8 . (3) RL = 16 .
Fig 14. Output power versus VCC
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
14 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
14.4 Single-ended application
Tamb = 25 C; VCC = 7.5 V; f = 1 kHz; RL = 8 ; Gv = 20 dB; audio band-pass 20 Hz to 20 kHz. The single-ended application diagram is shown in Figure 15.
1 F
R2 100 k R1 10 k
VCC INL- INL+ 15 14 17 10 16 OUTL-
100 nF C4 470 F RL = 8 100 F
VIL C3 47 F
OUTR-
1 F R4 100 k R3 10 k VIR
1
OUTL+
SA58632
INR- INR+ SVR MODE BTL/SE 12 13 3 2 4 20 7 GND
002aac091
C5 470 F RL = 8
11
OUTR-
6
OUTR+
R2 Gain left = -----R1 R4 Gain right = -----R3
Pins 8, 9, 18 and 19 connected to ground.
Fig 15. SE application circuit configuration
If the BTL/SE pin is to ground, the positive outputs (OUTL+, OUTR+) will be in mute condition with a DC level of 0.5VCC. When a headphone is used (RL > 25 ) the SE headphone application can be used without coupling capacitors by placing the load between negative output and one of the positive outputs (for example, pin 1) as the common pin. Increasing the value of the tantalum or electrolytic capacitor C3 will result in a better channel separation. Because the positive output is not designed for high output current (2 x IO) at the load impedance (< 16 ), the SE application with output capacitors connected to ground is advised. The capacitor value of C4/C5 in combination with the load impedance determines the low frequency behavior. The total harmonic distortion-plus-noise as a function of frequency was measured with a low-pass filter of 80 kHz. The value of the capacitor C3 influences the behavior of the PSRR at low frequencies; increasing the value of C3 increases the performance of PSRR.
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
15 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
102 THD+N (%) 10
(1) (2) (3)
002aac290
10 THD+N (%)
(1) (2) (3)
002aac291
1 1 10-1 10-1
10-2 10-2
10-1
1 Po (W)
10
10-2 10-2
10-1
1 Po (W)
10
(1) VCC = 7.5 V. (2) VCC = 9 V. (3) VCC = 12 V.
(1) VCC = 9 V. (2) VCC = 12 V. (3) VCC = 15 V.
a. RL = 4 ; f = 1 kHz; Gv = 10 dB
102 THD+N (%) 10
b. RL = 8 ; f = 1 kHz; Gv = 10 dB
002aac292
(1) (2) (3)
1
10-1
10-2 10-2
10-1
1 Po (W)
10
(1) VCC = 9 V. (2) VCC = 12 V. (3) VCC = 15 V.
c. RL = 16 ; f = 1 kHz; Gv = 10 dB Fig 16. THD+N versus output power
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
16 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
10 THD+N (%) 1
002aac093
-20 cs (dB) -40
002aac094
(1)
-60
(2)
10-1
(1) (2) (3)
-80
(3) (4) (5)
10-2 10
102
103
104 f (Hz)
105
-100 10
102
103
104 f (Hz)
105
Po = 0.5 W; Gv = 20 dB. (1) VCC = 7.5 V; RL = 4 . (2) VCC = 9 V; RL = 8 . (3) VCC = 12 V; RL = 16 .
Vo = 1 V; Gv = 20 dB. (1) VCC = 5 V; RL = 32 , to buffer. (2) VCC = 7.5 V; RL = 4 . (3) VCC = 9 V; RL = 8 . (4) VCC = 12 V; RL = 16 . (5) VCC = 5 V; RL = 32 .
Fig 17. THD+N versus frequency
-20 PSRR (dB) -40
002aac095
Fig 18. Channel separation versus frequency
002aac096
2.0 Po (W) 1.6
(1) (2)
(3)
1.2
(1)
-60
(2) (3)
0.8
0.4
-80 10
102
103
104 f (Hz)
105
0 0 4 8 12 VCC (V) 16
Rs = 0 ; Vripple = 100 mV. (1) Gv = 24 dB. (2) Gv = 20 dB. (3) Gv = 0 dB.
THD+N = 10 %. (1) RL = 4 . (2) RL = 8 . (3) RL = 16 .
Fig 19. PSRR versus frequency
Fig 20. Po versus VCC
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
17 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
4 P (W) 3
(1)
002aac097
(2)
(3)
2
1
0 0 4 8 12 VCC (V) 16
THD+N = 10 %. (1) RL = 4 . (2) RL = 8 . (3) RL = 16 .
Fig 21. Worst case power dissipation versus VCC
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
18 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
3 P (W) 2
(2) (3)
002aac293
3 P (W)
(3)
002aac294
2
(2)
1
(1)
1
(1)
0 0 0.4 0.8 1.2 Po (W) 1.6
0 0 0.8 1.6 Po (W) 2.4
(1) VCC = 7.5 V. (2) VCC = 9 V. (3) VCC = 12 V.
(1) VCC = 9 V. (2) VCC = 12 V. (3) VCC = 15 V.
a. RL = 4 ; f = 1 kHz; Gv = 10 dB
1.6 P (W) 1.2
(2)
b. RL = 8 ; f = 1 kHz; Gv = 10 dB
002aac295
(3)
0.8
(1)
0.4
0 0 0.4 0.8 1.2 Po (W) 1.6
(1) VCC = 9 V. (2) VCC = 12 V. (3) VCC = 15 V.
c. RL = 16 ; f = 1 kHz; Gv = 10 dB Fig 22. Power dissipation versus output power
14.5 General remarks
The frequency characteristics can be adapted by connecting a small capacitor across the feedback resistor. To improve the immunity of HF radiation in radio circuit applications, a small capacitor can be connected in parallel with the feedback resistor (56 k); this creates a low-pass filter.
14.6 SA58632BS PCB demo
The application demo board may be used for evaluation in either BTL or SE configuration as shown in the schematics in Figure 3 and Figure 15. The demo PCB is laid out for a 64.5 mm2 (10 in2) heat spreader (total of top and bottom heat spreader area).
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
19 of 26
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Product data sheet Rev. 01 -- 27 June 2006
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. SA58632_1
Philips Semiconductors
SA58632BS Rev5 Audio Amplifier
VCC GND OUTL+ OUTL-
100 F
10 k
10 k
INL- GND VCC/2 VCC
56 k 1 F 1 F
MODE
11 k 11 k
VCC SEL GND
1 F
GND
47 F
BTL/SE
56 k
INR-
1 F
OUTR+
OUTR-
2 x 2.2 W BTL audio amplifier
001aae327
SA58632
20 of 26
Fig 23. SA58632BS PCB demo
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
15. Package outline
HVQFN20: plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 6 x 5 x 0.85 mm
SOT910-1
D
B
A
terminal 1 index area
E
A A1 c
detail X
e1 1/2 e e
7
b
10
v w
M M
CAB C
C y1 C y
L
6 11
e
Eh 1/2 e
e2
1
16
terminal 1 index area
20
17
Dh 0 2.5 scale DIMENSIONS (mm are the original dimensions) UNIT mm A max 1 A1 0.05 0.00 b 0.4 0.3 c 0.2 D 5.1 4.9 Dh 3.15 2.85 E 6.1 5.9 Eh 4.15 3.85 e 0.8 e1 2.4 e2 4 L 0.65 0.40 v 0.1 w 0.05 5 mm
X
y 0.05
y1 0.1
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included OUTLINE VERSION SOT910-1 REFERENCES IEC --JEDEC MO-220 JEITA --EUROPEAN PROJECTION ISSUE DATE 05-10-11
Fig 24. Package outline SOT910-1 (HVQFN20)
SA58632_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
21 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
16. Soldering
16.1 Introduction to soldering surface mount packages
There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
16.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow temperatures range from 215 C to 260 C depending on solder paste material. The peak top-surface temperature of the packages should be kept below:
Table 8. SnPb eutectic process - package peak reflow temperatures (from J-STD-020C July 2004) Volume mm3 < 350 240 C + 0/-5 C 225 C + 0/-5 C Volume mm3 350 225 C + 0/-5 C 225 C + 0/-5 C
Package thickness < 2.5 mm 2.5 mm Table 9.
Pb-free process - package peak reflow temperatures (from J-STD-020C July 2004) Volume mm3 < 350 260 C + 0 C 260 C + 0 C 250 C + 0 C Volume mm3 350 to 2000 260 C + 0 C 250 C + 0 C 245 C + 0 C Volume mm3 > 2000 260 C + 0 C 245 C + 0 C 245 C + 0 C
Package thickness < 1.6 mm 1.6 mm to 2.5 mm 2.5 mm
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
16.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
SA58632_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
22 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
16.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 C and 320 C.
16.5 Package related soldering information
Table 10. Package[1] BGA, HTSSON..T[3], LBGA, LFBGA, SQFP, SSOP..T[3], TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC[5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L[8],
[1] [2]
Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable not suitable[4] Reflow[2] suitable suitable
suitable not not WQCCN..L[8] recommended[5][6] recommended[7]
suitable suitable suitable not suitable
PMFP[9],
not suitable
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
23 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[4]
[5] [6] [7] [8]
[9]
17. Abbreviations
Table 11. Acronym BTL CMOS DAP ESD NPN PCB PNP RMS SE THD Abbreviations Description Bridge-Tied Load Complementary Metal Oxide Semiconductor Die Attach Paddle ElectroStatic Discharge Negative-Positive-Negative Printed-Circuit Board Positive-Negative-Positive Root Mean Squared Single-Ended Total Harmonic Distortion
18. Revision history
Table 12. Revision history Release date 20060627 Data sheet status Product data sheet Change notice Supersedes Document ID SA58632_1
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
24 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
19. Legal information
19.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com.
19.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
19.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
20. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
SA58632_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 27 June 2006
25 of 26
Philips Semiconductors
SA58632
2 x 2.2 W BTL audio amplifier
21. Contents
1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 9 10 11 12 13 13.1 14 14.1 14.2 14.3 14.4 14.5 14.6 15 16 16.1 16.2 16.3 16.4 16.5 17 18 19 19.1 19.2 19.3 19.4 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 5 Mode select pin (MODE) . . . . . . . . . . . . . . . . . 5 BTL/SE output configuration. . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . . 8 BTL application . . . . . . . . . . . . . . . . . . . . . . . . . 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Static characterization . . . . . . . . . . . . . . . . . . . 9 BTL dynamic characterization . . . . . . . . . . . . 10 Thermal behavior . . . . . . . . . . . . . . . . . . . . . . 11 Single-ended application . . . . . . . . . . . . . . . . 15 General remarks . . . . . . . . . . . . . . . . . . . . . . . 19 SA58632BS PCB demo . . . . . . . . . . . . . . . . . 19 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23 Package related soldering information . . . . . . 23 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 24 Legal information. . . . . . . . . . . . . . . . . . . . . . . 25 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Contact information. . . . . . . . . . . . . . . . . . . . . 25 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. Date of release: 27 June 2006 Document identifier: SA58632_1

▲Up To Search▲

Price & Availability of SA58632

	To Download SA58632 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .